Lenovo ThinkSystem SD665 V3
Liquid cooling innovation for a highly efficient data center
Datasheet
Updated
10 Oct 2024Form Number
DS0152PDF size
3 pages, 224 KBInnovative Design
The Lenovo ThinkSystem SD665 V3 dual-node tray is designed for High Performance Computing (HPC), large-scale cloud, heavy simulations and modeling.
It supports Lenovo Neptune™ Direct Water Cooling (DWC) technology as well as workloads from technical computing, grid deployments, analytics, and is ideally suited for fields such as research, life sciences, energy, simulation, and engineering.
The unique design of ThinkSystem SD665 V3 provides the optimal balance of serviceability, performance, and efficiency.
By using a standard rack with the ThinkSystem DW612S enclosure equipped with patented stainless steel drip-less quick connectors, the SD665 V3 provides easy serviceability and extreme density that is well suited for clusters ranging from small enterprises to the world's largest supercomputers.
The Lenovo Neptune™ direct liquid cooling doesn't use risky plastic retrofitting but custom designed copper water loops, so you have peace of mind implementing a platform with liquid cooling at the core of the design.
Compared to other technology, the ThinkSystem SD665 V3 direct water cooling:
- Reduces data center energy costs by up to 40%
- Increases system performance by up to 10%
- Delivers up to 95% heat removal efficiency
- Creates a quieter data center with its fan-less design
- Enables data center growth without adding computer room air conditioning
Maximum Performance, Simplified Management
Designed to run the highest core-count 5th Generation AMD EPYC™ Processor, the SD665 V3 powers through demanding HPC workloads. Because water cooling removes more heat constantly, CPUs can run in accelerated mode nonstop, getting up to 10% greater performance from the CPU.
The 5th Generation AMD EPYC™ Processors combine both superior memory bandwidth capacity and core-counts that are capable of increasing performance across all HPC workloads.
The 5th Generation AMD EPYC™ Processors excel in HPC application and workloads that are memory sensitive, scale well to multiple cores, and are not highly vectorized applications within the manufacturing/computer-aided engineering (CAE) and weather/climate verticals like OpenFOAM, ANSYS Fluent, ANSYS CFX, ANSYS LS-DYNA, Siemens STAR-CCM+, MOM5, and WRF.
For even greater system performance, the SD665 V3 uses 6400MHz DDR5 memory and supports NVMe storage, high-speed NDR InfiniBand.
The Lenovo ThinkSystem SD665 V3 is enabled with Lenovo HPC & AI Software Stack, so, you can support multiple users and scale within a single cluster environment.
Lenovo HPC & AI Software Stack provides our HPC customers you with a fully tested and supported open-source software stack to enable your administrators and users with for the most effective and environmentally sustainable consumption of Lenovo supercomputing capabilities.
Our Confluent management system and Lenovo Intelligent Computing Orchestration (LiCO) web portal provides an interface designed to abstract the users from the complexity of HPC cluster orchestration and AI workloads management, making open-source HPC software consumable for every customer.
LiCO web portal provides workflows for both AI and HPC, and supports multiple AI frameworks, allowing you to leverage a single cluster for diverse workload requirements.
Extreme Density
One 6U ThinkSystem DW612S enclosure accommodates up to 12 SD665 V3 compute nodes. With up to 6 chassis in a traditional 42U rack, the enclosure houses up to 144 processors, 216 TB of DDR5 Memory, and up to 144x PCIe Gen5 x16 adapters on just two data center floor tiles. The ThinkSystem SD665 V3 offers more than 3X the cores per U than the previous generation SD650 V2 server.
Savings and Efficiency
With up to 95% heat removal efficiency, the ThinkSystem SD665 V3 provides up to a 40% savings in data center energy expense including:
- 25% reduction in annual air conditioning use
- 5% energy savings by running cooler CPUs
- 5% savings by eliminating fans in the compute nodes
- 5% optimization from Energy Aware Runtime
A large supercomputing center reusing hot water from direct water cooling can save an estimated 45% in electricity costs.
Specifications
| Form Factor | Full-wide 1U tray; 2 nodes per tray |
| Chassis | DW612S Enclosure (6U) |
| Processors | 2x 5th Generation AMD EPYC™ Processors per node |
| Memory | Up to 3.0TB using 24x 128GB 6400 MHz TruDDR5 RDIMM slots per tray |
| I/O Expansion | Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported. |
| Internal Storage | Up to 4x 2.5-inch NVMe SSDs (7mm height) or 2x 2.5-inch NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions |
| RAID Support | OS Software RAID |
| Network Interfaces | Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI) |
| Power Management | Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR) |
| Systems Management | Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements |
| Front Access | All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management. |
| Rear access | 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection |
| Power Supply | Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy |
| Cooling Design | Direct Water Cooling at the heat source with up to 50°C inlet water temperature |
| OS Support | Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information. |
| Limited Warranty | 3-year customer replaceable unit and onsite limited warranty, next business day 9x5, service upgrades available |
About Lenovo
Lenovo (HKSE: 992) (ADR: LNVGY) is a US$62 billion revenue global technology powerhouse, ranked #171 in the Fortune Global 500, employing 77,000 people around the world, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver smarter technology for all, Lenovo is expanding into new growth areas of infrastructure, mobile, solutions and services. This transformation is building a more inclusive, trustworthy, and sustainable digital society for everyone, everywhere.
For More Information
To learn more about the ThinkSystem SD665 V3, contact your Lenovo representative or Business Partner or visit www.lenovo.com/thinksystem. For detailed specifications, consult the SD665 V3 product guide.
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§ Based on Lenovo internal testing.
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Document number DS0152, published October 10, 2024. For the latest version, go to lenovopress.lenovo.com/ds0152.
